Mechanical Testing Solutions For Electronics And Semiconductors

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Advance Product Reliability With High-Precision Analytical Technologies

 

  • As the technology landscape drives toward smaller process nodes, higher performance, and greater reliability, precise analysis and measurement have become essential across every stage of development and manufacturing. From material characterization and component validation to failure analysis and quality assurance, manufacturers require trusted analytical solutions that deliver accurate, repeatable results while supporting faster innovation and production efficiency.

    Shimadzu provides a comprehensive portfolio of advanced analytical technologies designed to meet these evolving industry needs. Leveraging decades of expertise in precision instrumentation, these systems enable engineers, researchers, and manufacturers to evaluate material properties, verify product reliability, investigate failures, and maintain stringent quality standards. Our solutions support a wide range of applications, helping customers accelerate development, optimize manufacturing processes, and deliver reliable, high-performance products with confidence.

    These solutions adapt to diverse application needs, helping teams optimize manufacturing processes, streamline development timelines, and deliver high-performance products with confidence. Whether developing next-generation hardware or managing large-scale manufacturing lines, Shimadzu delivers the precision, reliability, and innovation required to solve modern testing challenges.

  • Mechanical Testing Solutions For Electronics And Semiconductors | Shimadzu

Materials And Components Covered

  • PCB

    Printed Circuit Board (PCB)

  • Semiconductors

    Semiconductors

  • Solder

    Solder

  • Sensor

    Sensors

  • LED

    LED

  • Smartphones

    Smartphones

  • Wafers

    Wafers

  • Others

    Others

Semiconductor And PCB
Manufacturing Process & Critical Mechanical Testing Stages

 

Semiconductor Manufacturing Process & Critical Mechanical Testing Stages

Mechanical Testing Flowchart

 

  •  

    Semiconductor Manufacturing Process Mechanical Testing Required? Typical Tests
    Back grinding Occasionally Fracture/bending (mainly R&D)
    Dicing Occasionally Fracture (specialized methods)
    Die attach Yes Peel, tensile, compression
    Flip-chip assembly Yes Solder joint reliability, cyclic bending
    Molding Yes Compression, flexural, tensile
    Package qualification Yes Bending, peel, compression, cyclic bending
  •  

    PCB Manufacturing Process Mechanical Testing Required?
    Incoming CCL inspection Yes
    Lamination Yes
    Final inspection Yes
    Reliability qualification Yes

 

Types Of Testing

 

  Components Testing Applications
stack-of-copper-clad-pcb-printed-circuit-board-material
Copper-clad Laminate (CCL) And Flexible Copper-clad Laminate (FCCL) Tensile, Peel (Adhesion) Bending (For CCL)
computer-board-with-chips
Printed Circuit Board (PCB) And Flexible Printed Circuit (FPC), PCB Assembly (PCBA) Tensile, Peel (Adhesion), Bending, Circuit Board Shear Test, Solder Joint Reliability, Board Bending
microchip-on-circuit-board
IC (Integrated Circuit) And BT (Bismaleimide-triazine) Substrates Peel (Adhesion), Bending, Cyclic Bending, Ball Shear
copper-circuit-board-intricate-paths-on-a-black-background
Copper Foil Conductive Layer For Substrates & Packages: Hyper Very Low Profile (HVLP) Copper Foil, VLP, Electro-deposited Copper Foil Tensile, Peel (Adhesion)
close-up-of-a-circuit-board-showing-intricate-gold-pathways
High Density Interconnect (HDI) Board; Substrate-like PCB (SLP) Board Board Deformation
cross-section-view-of-a-multilayer-printed-circuit-board
PCB Substrate Materials (CCL, Prepreg, Resin Systems, ABF, BT Resin, EMC, Low-dk Materials, Etc.) Resin And Material Flow Behavior Study
gloved-hands-handling-thin-film
Die Attach Film (DAF), And Other Semiconductor Packaging Materials Peel, Adhesive Film Tensile, Die Adhesion Strength After Bonding
technician-lifting-tiny-chips-from-inspection-tray
Outsourced Semiconductor Assembly And Test (OSAT) Die Shear Test, Ball Shear Test
soldering-iron-connecting-microchip
Solder Joint Ball Shear Testing, Lead Pull Testing, BGA Reliability
fiber-optical-transceiver-module
Connector Insertion Force, Withdrawal Force, Retention Force, Micro-load Compression

Examples Of Test Setup

Examples Of Test Setup

 

Advanced Mechanical Testing Solutions

Tensile Testing Instruments

Shimadzu Solutions - Tailored To Your Needs

EZ-X Universal Testing Machine (1N up to 5kN)

EZ-X Universal Testing Machine | Shimadzu

The Shimadzu EZ-X is a compact, single-column tabletop Universal Testing Machine designed for smaller load and sample sizes.

AGS-V Universal Testing Machine

AGS-V

The Shimadzu Autograph AGS-V Series provide the best cost-to-performance and practical testing solutions for a wide array of applications. Offering high-level control and intuitive operation, the AGS-V series set a new standard for strength evaluations while providing the utmost in safety considerations in a modern, stylish design.​ ​

AGX-V2 Universal Testing Machine (1N up to 600kN)

AGX-V2

The Shimadzu AGX-V2 is a flagship dual-column Universal Testing Machine, featuring the latest advancements in testing technology. Available in both tabletop and floor models to accommodate varying load capacities and sample sizes, it is suitable for testing a wide range of materials and components testing (R&R and QA/QC)

Electromagnetic Force Fatigue And Endurance Testing System EMT​

Electromagnetic Force Fatigue And Endurance Testing System | Shimadzu

High-speed repeated load tests can be performed at a maximum velocity of 2 m/s and a maximum stroke of ±50 mm,utilizing clean and quiet electromagnetic force as the driving power—eliminating the need for oil. The spacious test area also allows for environmental testing with the optional constant temperature tank.​

Magnetic Micro Testing System MMT

Magnetic Micro Testing System MMT | Shimadzu

The Microservo MMT series adopts an electromagnetic actuator with an exceedingly high frequency response for its loading mechanism. By combining this with closed loop control, high speed and high precision control is possible over micro loads and micro displacement, making it ideal for dynamic testing of small and highly functional parts in the electronics and communication industries. ​

Servopulser Table-Top Fatigue and Endurance Testing Machine EHF-L Series

Servopulser Table-Top Fatigue and Endurance Testing Machine EHF-L Series

Fatigue and impact testing assess the durability of raw materials or components by evaluating their fatigue strength and impact properties under various environmental conditions. These compact tabletop models, featuring a top-mounted actuator on an L-type loading frame, are versatile tools capable of performing a wide range of fatigue and endurance tests. They are suitable for testing materials like polymers and rubber, as well as small components or parts. ​

High-Speed Tensile/Impact Testing Machine HITS-X​

High-Speed Tensile/Impact Testing Machine | Shimadzu

As the demand for safety and reliability grows, evaluating the dynamic strength (impact properties) of materials andcomponents has become increasingly critical. This machine provides essential data, including maximum test force,energy, and displacement, at speeds of up to 72 km/h (20 m/s). It is available in two configurations: a tensile load type(HITS-TX) and a punching type (HITS-PX).​

Capillary Rheometer Flowtester CFT-EX

Capillary Rheometer Flowtester | Shimadzu

This device evaluates viscosity properties by analyzing their relationship to temperature, pressure, and flow velocity forflowable materials. It is highly useful in research and development, production processes, and quality control across a wide range of materials, including thermoplastic resins, thermosetting resins, toners, composite materials, ceramics, and rubbers.​

Micro Compression Testing Machine MCT

Micro Compression Testing Machine MCT | Shimadzu

The MCT series micro compression testing machine evaluates the strength of various types of micro components, micro particles generated in powder processing, and fine fibers used in new materials. ​

Dynamic Ultra Micro Hardness Tester DUH

Dynamic Ultra Micro Hardness Tester DUH

Building on our experience with hardness evaluation technology for the micro range, we have taken our quest for greater precision and ease of use to the next level. DUH hardness tester can measure the strength properties of material surfaces and microscopic materials using new evaluation methods specified in international test standards.

 

 

Application Solutions

Instruments For Analyzing / Evaluating Electronic Devices

Instruments For Analyzing / Evaluating Electronic Devices

Electronic devices and semiconductor technologies support a variety of industries and add comfort to our lives. Shimadzu develops and manufactures a wide range of instruments to help manufacturers conduct quality control of electronic devices and comply with regulations and directives. This catalog introduces equipment and related applications, such as observation of minute parts, elemental analysis, evaluation of optical properties, measurement of hazardous substances, and evaluation of mechanical properties.

Equipment Used In Semiconductor Manufacturing Processes And Evaluation Examples

Equipment Used In Semiconductor Manufacturing Processes And Evaluation Examples

This brochure presents examples of evaluation methods and details the measurement equipment critical for semiconductor manufacturing processes, encompassing material development, processing, and inspection.