Upcoming Webinars
19 May 2026
Accelerating ROI With Shimadzu Living Laboratory:
Transforming Data Intelligence With AI & Automated Networked Systems
In modern laboratory environments, fragmented data and manual workflows create significant bottlenecks that delay critical decision-making. Hear from our experts as they uncover how you can transform your laboratory operations by unifying the entire analytical lifecycle—from initial method development to final quality control (QC).
In this session, you will see how to move past siloed data and achieve true Data Intelligence through Shimadzu's seamless, networked and digital automation. We will share practical strategies for CRO, CDMO, and R&D sectors to leverage intelligent method development and centralized laboratory management to reduce manual intervention while boosting data reliability.
Join us to learn how your software and hardware can converge into “The Living Laboratory.” Discover how this unified ecosystem from Shimadzu & Caliber helps you accelerate time-to-results, simplify regulatory compliance, and drive a superior ROI. Register Now!
- Learning Objectives
- • Understand the role of AI and automation in modern laboratories
- • Explore data intelligence through networked laboratory ecosystems
- • Identify strategies to embrace the AI technology for lab processes
- Time
2.30 PM Singapore Time (60mins)
Date
19 May 2026
19 May 2026
All About Semiconductor Manufacturing:
Advanced Failure Analysis From Physical To Chemical Defects
In the high-stakes world of semiconductor manufacturing, even a microscopic defect can significantly impact yield and long-term reliability. Identifying whether a failure is a physical structural issue or a hidden chemical contaminant is a critical challenge across the production workflow.
Join us in this Digital Classrooms session where we showcase a comprehensive approach to solving the "defect puzzle." We’ll demonstrate how integrating advanced analytical technologies— from non-destructive X-ray visualization with the inspeXio 7000 to high-resolution surface and material characterization with the AXIS Supra+ —provides the clarity needed to keep production on track.
We will also explore the source of defect formation through trace-level elemental analysis using the ICPMS-2050, alongside versatile X-ray imaging platforms like the SMX-1020 and SMX-6010.
Discover how you can effectively pinpoint root causes faster, giving you the insights to strengthen process control and maximize your semiconductor yield. Register Now!
- Learning Objectives
- • Understand key differences between 2D X-Ray inspection and 3D computed tomography in relation to production and failure analysis
- • Determine the suitable 3D computed tomography analysis for electrical and electronics components, semiconductor packages and multi-layer mounted circuit boards
- • By using the AXIS Supra+ XPS system to examine surface composition and chemical states at defect sites, defects can be linked more quickly to contamination, oxidation, interfacial reactions, or other failure mechanisms
- • Use ICP-MS (ICPMS-2050) to detect ultra-trace metallic contaminants in semiconductor-grade chemicals that may lead to defect formation and reliability issues
- Time
3.00 PM Singapore Time (60mins)
Date
4 June 2026