SPOTLIGHT
Exclusive Webinar
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In the high-stakes world of semiconductor manufacturing, even a microscopic defect can significantly impact yield and long-term reliability. Identifying whether a failure is a physical structural issue or a hidden chemical contaminant is a critical challenge across the production workflow. Join us in this Digital Classrooms session where we showcase a comprehensive approach to solving the "defect puzzle." We’ll demonstrate how integrating advanced analytical technologies— from non-destructive X-ray visualization with the inspeXio 7000 to high-resolution surface and material characterization with the AXIS Supra+ —provides the clarity needed to keep production on track. |
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Webinar Objectives:
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Determine the suitable 3D computed tomography analysis for electrical and electronics components, semiconductor packages and multi-layer mounted circuit boards
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By using the AXIS Supra+ XPS system to examine surface composition and chemical states at defect sites, defects can be linked more quickly to contamination, oxidation, interfacial reactions, or other failure mechanisms
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Use ICP-MS (ICPMS-2050) to detect ultra-trace metallic contaminants in semiconductor-grade chemicals that may lead to defect formation and reliability issues
EG DEG Testing In Raw Materials
Analysis of Ethylene Glycol and Diethylene Glycol in Glycerin, Propylene Glycol and Sorbitol Solutions (Indian Pharmacopoeia Monographs)
This application highlights the use of GC-FID for analyzing EG and DEG contaminants in glycerin, propyleneglycol (PG), and sorbitol solutions (70%) in compliance with Indian Pharmacopoeia (IP) monographs. TheBrevis GC, paired with the AOC-30i autosampler, delivers highly reproducible results using the proposedworkflow. Notably, the configuration outlined in this application exceeds the stringent requirements specifiedin the IP monographs, ensuring superior analytical performance and reliability for contaminant analysis.